facilities
Table of Contents
NanoLab facilities
Deposition
Sputtering
- 4-magnetron UHV sputtering system (loadlock)
- 3-target Leybold Z-400 diode sputtering system
- 4-source reactive oxides system for the epitaxial growth of Perovskites
- 4-source AJA ATC-1800 with substrate heating, cooling and RF bias (loadlock)
- Available targets
Evaporation
- UHV multi-crucible e-gun evaporator for shadow evaporation (loadlock)
Substrate preparation
- laminar flow unit in 603
- fumehood in 603 for heating liquids and wet cleaning processes
- Pt-Ir sputtering system for EM specimen preparation
- Carbon evaporator for EM specimen preparation
Lithography
- Electron beam lithography, the Raith 100 / E-line with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm.
- Optical lithography is still done
Etching
- PlasmaLab 90+ RIE etcher (fluorine etcher, SF6, CF4, O2, Ar)
- ion beam etcher for dry etching (can do CAIBE)
- Nanoscale ion milling is done with the dual beam SEM/FIB at the HREM centre in Delft (400 euro per day)
- O2 barrel etcher for resist removal and substrate cleaning
- wetbench in the clean room for development and wet etching
- A fume hood for the use of strong acids in 607
Analysis and inspection
- FEI NanoSEM 200 scanning electron microscope (BioAFM group) (features a nanotube/wire nanomanipulator, EBID deposition, low vacuum mode, STEM, cryoSEM and many other options)
- JEOL 820 SEM scanning electron microscope
- RBS analysis at Amolf
- 120 kV Philips EM410 transmission electron microscope
- optical microscopes in the cleanroom and 614
- AFM for measuring surface topograpy of films and structures, MFM, EFM etc.
- The group has a low angle X-ray diffraction system Siemens D5005 that can measure the crystal structure (if any) and thickness of thin films
Sample mounting
- wire bonder for bonding Al and Au wire
Computing
- Raith E_line for e-beam structure design at the e-beam and in 626
- Rump in 626 for RBS spectrum simulation
- Specon in 614 for Ortec channel data to RUMP conversion
- Sputsim for MC/MD simulation of magnetron sputtering / liftoff processes
- Casino in 626 for MC simulation of electrons in resists/substrates
- SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering
- Analysis in 614 for SEM image analysis
facilities.txt · Last modified: 2018/05/16 15:36 by wolfgang