cressington_sputter_coater_208hr
Table of Contents
Description
Manual
Sample Loading
- Lift the top plate and remove the glass cylinder. Take care that the top-plate does not fall forward. The target can be damaged by striking the sample table.
- Place your sample, mounted on a stub, on the stage.
- Unlock the tilt lever of the stage.
- Set tilt at desired angle and lock the tilt lever again.
- If a thickness controlled process will be used change the angle of the thickness crystal so that it faces towards the sputter target.
- Check that the stage isn't hindered by the wire of the thickness crystal by letting the stage rotate at the desired speed.
- Replace glass cylinder and gently lower the top plate. Check that the top plate sits correctly on the glass cylinder.
- Turn on the system and allow the system to pump to better than 0,01 mbar and then wait for another 5 minutes.
Automatic Controlled Process
Pre-Sputtering
- Select Auto with the auto/manual button.
- Select timer.
- Set pre-sputtering time at 10 seconds by holding PAUSE/TEST and pressing the timer SET buttons.
- Set pre-sputter current to desired value by holding the SET mA button and pressing the timer SET buttons. Available currents 20, 40, 60, and 80 mA.
- Make sure the shutter is closed
- Press CYCLE/STOP to start pre-sputering process. The system will proceed through its standard cycle.
Sputtering
- Select timer for a timed process or MTM for a thickness controlled process.
- Timed process, Change sputtering time by holding PAUSE/TEST and pressing the timer SET buttons. Time can be set between 5 and 300 seconds.
- Thickness controlled process
- Turn on the thickness monitor (MTM 20)
- Set the correct density according to the target material by pressing the DENSITY button once and find the correct setting by scrolling with the scroll buttons.
- Set the correct tooling factor according to stage tilt by pressing the TOOLING button once and find the correct setting by scrolling with the scroll buttons.
- Set desired coating thickness by holding the TERMINATOR button for one second. The value for the thickness will show up and can be adjusted with the scroll buttons.
- Set sputter current to desired value by holding the SET mA button and pressing the timer SET buttons. Available currents 20, 40, 60, and 80 mA.
- Set roatating speed of stage at desired value.
- Open shutter
- Press CYCLE/STOP to start the sputtering process. The system will proceed through its standard cycle.
- After sputtering note the final thickness for a thickness controlled process.
- Close shutter.
When Done
- Switch off the system to automatically vent the chamber, which will take approximately 2 minutes.
- Lift the top plate and remove the glass cylinder.
- Set tilt of the stage to the horizontal position.
- Remove your sample.
- Clean inside of the glass cylinder with a tissue and ethanol to keep the glass clear.
- Replace glass cylinder and gently lower the top plate. Leave the system vented.
Manual process for Cr-sputtering
- Select manual with the auto/manual button.
- Select timer for a timed process or MTM for a thickness controlled process.
- Timed process, Change sputtering time by holding PAUSE/TEST and pressing the timer SET buttons. Time can be set between 5 and 300 seconds.
- Thickness controlled process
- Turn on the thickness monitor (MTM 20)
- Set the correct density according to the target material by pressing the DENSITY button once and find the correct setting by scrolling with the scroll buttons.
- Set the correct tooling factor according to stage tilt by pressing the TOOLING button once and find the correct setting by scrolling with the scroll buttons.
- Set desired coating thickness by holding the TERMINATOR button for one second. The value for the thickness will show up and can be adjusted with the scroll buttons.
- Set sputter current to 80 mA by holding the SET mA button and pressing the timer SET buttons.
- Set rotating speed of stage at desired value.
- Open argon flush valve for 10 seconds, then close.
- Pump to 0,001 mbar
- Open argon flush valve for 3 seconds, then close
- Open leak valve.
- When pressure reaches better than 0,03 mbar set MTM-20 to ZERO for a thickness controlled process
- Press START/STOP to start sputtering
- Initially the discharge will be pink of colour. It will turn blue when the surface layer of chromium oxide is removed and chromium begins toe sputter.
- When plasma turns blue open the shutter
- After sputtering note the final thickness for a thickness controlled process.
- Close shutter.
Available Targets
Target Material | Atomic Number | Density in g/cm³ |
---|---|---|
Pt/Pd (80/20) | 78/46 | 19,52 |
Cr | 24 | 7,19 |
Ir | 77 | 22,56 |
Deposition Rates
Target Material | Date | User | Tilt | Current | Time | Measurement | Result | Rate |
---|---|---|---|---|---|---|---|---|
Pt/Pd (80/20) | 40 mA | |||||||
Cr | 80 mA | |||||||
Ir | 40 mA |
cressington_sputter_coater_208hr.txt · Last modified: 2015/08/10 08:04 by steenis