Plasma Cleaner manual

Only use bare substrate in the plasma cleaner, all exceptions should be discussed.

• Si
• SiO2
• glass/quartz

• Load samples on the sample tray
• Start the vacuum pump while holding the door, make sure black valve is pointing down
• Pump down to <100mTorr
• Set black valve to the needle valve
  • if needle valve is open the pressure should go to previous setpoint (check the logbook)
  • or change the setpoint
• Wait for pressure to stabilize
• set RF (low, mid or high)
• When plasma ignites start your timer
• Turn off RF when timer finishes
• Close black valve (valve pointing down)
• Pump down to <100mTorr to make sure etch products are removed from the chamber
• Stop the vacuum pump
• Turn black valve to the right to vent
  • vent slowly to avoid samples flying around in the chamber
• Close black valve (valve pointing down)
• close the door
• write in the logbook: name, date, sample, process conditions, any remarks

Typical cleaning process:
500-900mTorr
1-3 minutes
High RF

Tip seal change of vacuum pump
Cleaning sample tray and chamber