Select manual with the auto/manual button.
Select timer for a timed process or MTM for a thickness controlled process.
Timed process, Change sputtering time by holding PAUSE/TEST and pressing the timer SET buttons. Time can be set between 5 and 300 seconds.
Thickness controlled process
Turn on the thickness monitor (MTM 20)
Set the correct density according to the target material by pressing the DENSITY button once and find the correct setting by scrolling with the scroll buttons.
Set the correct tooling factor according to stage tilt by pressing the TOOLING button once and find the correct setting by scrolling with the scroll buttons.
Set desired coating thickness by holding the TERMINATOR button for one second. The value for the thickness will show up and can be adjusted with the scroll buttons.
Set sputter current to 80 mA by holding the SET mA button and pressing the timer SET buttons.
Set rotating speed of stage at desired value.
Open argon flush valve for 10 seconds, then close.
Pump to 0,001 mbar
Open argon flush valve for 3 seconds, then close
Open leak valve.
When pressure reaches better than 0,03 mbar set MTM-20 to ZERO for a thickness controlled process
Press START/STOP to start sputtering
Initially the discharge will be pink of colour. It will turn blue when the surface layer of chromium oxide is removed and chromium begins toe sputter.
When plasma turns blue open the shutter
After sputtering note the final thickness for a thickness controlled process.
Close shutter.