===== Flat Au on MoGe =====
Recipe for flat Au: 25% Ar, 39% O2, 1 kV (for avoiding oxidation of interface: first 8 sec without O2)
- Note background pressure in logbook.
- **Switch on cooling water (blue button)**.
- Check the timings and positions for the (pre) sputtering, **note this in the logbook**.
- Switch on power supply (red turning knob). It takes 2 minutes for the RF generator to warm up.
- Set the Argon flow setpoint (using the software, usually around 30-50 sccm) and set the MFC valve to 'Normal'.
- Check that the desired pressure is reached (typically 5E-3 mbar), if not adjust the flow accordingly.
- Switch on the mass flow controller electronics (for the O2 and N2 MFC's)
- Select the channel for O2 on the electronics
- Set the flip switch for O2 to the ''middle'' (regulating) position and set 39% with the potentiometer knob
- After the flow has stabilised, leave the flow settings as they are and put the flip switch in ''down'' position (close)
- **Pres puttering**
- Select Au target with HV target selector knob (left of the chamber).
- Set the Au target to the pre sputter position.
- Set the DC voltage meter to 1 kV full scale (right display).
- Turn the HV setpoint to zero (black knob on power supply).
- Turn HV on (two on/off buttons).
- Set 500 V RF (2nd display from the left, 5 kV scale).
- Increase the flow setpoint temporarily to 75 sscm and check that the pressure rises.
- Wait until the plasma ignites (right display shows non-zero value).
- **Quickly** check that the ignited target is at pre sputter position (look through window, purple glow at front position).
- Next set the flow to the original value and check that the pressure stabilises at 5E-3 mbar.
- Set the DC potential to the desired value (typically 1 kV).
- With the pressure and the plasma stable, time the pre sputtering of Au
- When finished set HV setpoint to zero and **switch off HV** (red ''HV off'' button)
- Repeat the ''pre sputter''steps above for the MoGe target, but leave the target ignited after pre sputtering!
- **Sputtering**
- With the MoGe target still ignited, move the target over your samples and time the deposition
- Move back the MoGe target to pre sputter position and set HV setpoint to zero and **switch off HV** (red ''HV off'' button)
- Select Au target with HV target selector knob (left of the chamber).
- Set the Au target to the pre sputter position.
- Set the DC voltage meter to 1 kV full scale (right display).
- Turn the HV setpoint to zero (black knob on power supply).
- Turn HV on (two on/off buttons).
- Set 500 V RF (2nd display from the left, 5 kV scale).
- Increase the flow setpoint temporarily to 75 sscm and check that the pressure rises.
- Wait until the plasma ignites (right display shows non-zero value).
- **Quickly** check that the ignited target is at pre sputter position (look through window, purple glow at front position).
- Next set the flow to the original value and check that the pressure stabilises at 5E-3 mbar.
- Set the DC potential to the desired value (typically 1 kV).
- With the pressure and the plasma stable, move the target over your samples and time the deposition
- After 8 seconds blend in O2 by setting the O2 flip switch to the ''middle'' position again
- Finish deposition and move target to pre sputter position
- Set the O2 flip switch to ''down'' position
- Wait for the flow to be < 1% and switch off MFC electronics
- Set HV setpoint to zero and **switch off HV** (red ''HV off'' button)
- **End**
- Close the MFC ('Close' button in software, read dialog, press OK).
- Switch off HV power supply (left red turning knob).
- Switch off cooling water.
- Check that the mass flow controller valve is closed (indicated in the software by 'Vlv: C').
- ** Vent with normal operating procedure**