====== A note about deposition rates ======

The calibrations can be found on the page of each deposition system.
It is crucial to include **all** relevant informantion about the process.
A calibration should always include:
   * Date of sample fabrication
   * Sample ID to find sample in system logbook
   * Process parameters (pressure, current, voltage, deposition time, xtal thickness etc.)
   * Measurement method (X-ray, RBS, AFM etc.)
   * Measurement result
   * Rate (nm/s or nm/A)

====== To the calibrations ======

   * [[UHV system#deposition_rates|UHV sputtering system]]
   * [[Z-400#deposition_rates Z406|Z-400 sputtering system]]
   * [[Oxides system#deposition_rates|Oxide epitaxy system]]
   * [[ATC-1800#deposition_rates|ATC-1800F sputtering system]]
   * [[K-Cell evaporator#deposition_rates|K-cell evaporator]] 
   * [[E-gun evaporator#deposition_rates|UHV E-gun evaporator]]